A near-zero-CTE substrate for co-packaged optics that keeps fibre and waveguide alignment stable under thermal load.
Co-packaged optics place photonic engines beside hot switch ASICs; sub-micron misalignment between waveguides, fibres, and couplers costs optical power. The interconnect substrate sees steep thermal gradients from the adjacent ASIC; any expansion walks the optical alignment out of budget and degrades link margin. Fixed-CTE substrates can't be set to near-zero at the photonics' actual operating temperature, so alignment stability is a design compromise.
Strocera supplies the substrate with CTE tuned to near-zero at the photonic engine's operating point, delivered as a ready-to-fire powder blend so it is formulated to the package thermal map. You specify the operating temperature and alignment budget; the mix is adjusted to hold sub-micron stability through the ASIC's thermal load. In-house forming keeps the optical-package iteration loop short; expansion is dilatometry-traceable for link-budget analysis.
Full Adaptive Glass-Ceramic specNear-zero CTE tuning validated by dilatometry at the customer operating point.
Co-packaged-optics and silicon-photonics packaging engineers needing a near-zero-CTE interconnect substrate.
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Tell us the operating conditions. We'll formulate Adaptive Glass-Ceramic to your application, and ship a ready-to-fire powder blend, not a 12-18 month blank.
